Wet Bonding Technology for Adhesives

A flexible solution

Adhesive raw materials for wet-in-wet bonding of flexible substrates

Bonding flexible materials, such as textiles and leather can be a challenge. It can be difficult to evenly apply the adhesive. In addition, the substrates are often heat sensitive, which limits the use of heat-activated solutions. Wet-in-wet bonding is often used to overcome these challenges.

Wet bonding adhesives

During the wet-in-wet bonding process, an adhesive is applied to materials to be bonded. They are then pressed together while the adhesive remains in the wet state. Physical bonding occurs as the solvent or water evaporates or is absorbed into the substrates.

For wet-in-wet bonding to be effective, at least one of the substrates to be bonded must be permeable to solvent or water vapor. This is necessary for drying to occur.

Because the adhesive is applied wet and the two substrates are joined while the adhesive is still wet, flexible substrates can be bonded more easily. Drying can take place at room temperature, making this bonding method suitable for temperature-sensitive materials.

Covestro offers a range of Dispercoll® U polyurethane  and Dispercoll® C  polychloroprene dispersions for the formulation of waterborne adhesives designed for wet-in-wet bonding applications.

Adhesives based on Dispercoll® dispersions have several benefits, including:

  • Softness and flexibility
  • Excellent initial bond strength
  • High final bond strength, even for challenging substrates
  • Good thermal resistance
  • Attractive environmental profile

Dispercoll® dispersions are used for the formulation of waterborne adhesives intended for wet-in-wet bonding applications in the footwear, furniture, packaging and paper processing industries.

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